IC Design & Chip Exhibition Area: IC and related electronic product design, AI chips, power management chips, IoT chips, 5G communication chips and solutions, automotive electronic chips, security control chips, mixed-signal communication RF chips, memory chips, LED lighting and display driver chips, etc.

Wafer Manufacturing & Packaging Exhibition Area: Wafer manufacturing, SiP advanced packaging, OSATs, EMS, OEMs, IDM, silicon wafers and IC packaging substrates, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing and packaging testing, EDA, MCUs, printed circuit boards, packaging substrate semiconductor materials and equipment, etc.

Third-generation semiconductor exhibition area: Third-generation semiconductors include silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronic devices (light-emitting diodes (LEDs), lasers (LDs), ultraviolet detectors), power electronic devices (diodes, MOSFETs, JFETs, BJTs, IGBTs, GTOs, ETOs, SBDs, HEMTs, etc.), and microwave RF devices (HEMTs, MMICs), etc.

Semiconductor Equipment Exhibition Area: Thinning machines, single crystal furnaces, grinding machines, heat treatment equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, die bonders, plasma cleaning equipment, dicing machines, wafer loaders, bonding machines, wire bonders, reflow soldering machines, wave soldering machines, testing machines, sorting machines, coupling machines, tape forming machines, inspection equipment, constant temperature and humidity test chambers, sensors, packaging molds, test fixtures, precision slides, stepper motors, valves, probe stations, cleanroom equipment, water treatment equipment, etc.

Semiconductor Materials Exhibition Area: Silicon wafers, silicon wafers, photoresists, wafer tapes, photomasks, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging and testing materials, slicing, grinding, polishing, thin films, etc.