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Housing Encapsulation: Apply adhesive to the housing and install a base plate to ensure proper bonding.

Power Terminal Bonding

Housing Encapsulation and Curing: Apply A and B adhesives to the inside of the housing, apply vacuum, and cure at high temperature to achieve insulation protection.

Encapsulation and Terminal Forming: Install a top cover on the product and bend the terminals into shape.

Functional Testing: After forming, conduct high and low temperature impact tests and aging tests on the product. Test the static and dynamic parameters of the IGBT to ensure compliance with factory standards for finished IGBT modules.